JPS6125217B2 - - Google Patents

Info

Publication number
JPS6125217B2
JPS6125217B2 JP53143092A JP14309278A JPS6125217B2 JP S6125217 B2 JPS6125217 B2 JP S6125217B2 JP 53143092 A JP53143092 A JP 53143092A JP 14309278 A JP14309278 A JP 14309278A JP S6125217 B2 JPS6125217 B2 JP S6125217B2
Authority
JP
Japan
Prior art keywords
layer
metal
aluminum
metal layer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53143092A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5568653A (en
Inventor
Toshihiko Ono
Junosuke Kawabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14309278A priority Critical patent/JPS5568653A/ja
Publication of JPS5568653A publication Critical patent/JPS5568653A/ja
Publication of JPS6125217B2 publication Critical patent/JPS6125217B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP14309278A 1978-11-20 1978-11-20 Manufacturing method of semiconductor device Granted JPS5568653A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14309278A JPS5568653A (en) 1978-11-20 1978-11-20 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14309278A JPS5568653A (en) 1978-11-20 1978-11-20 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5568653A JPS5568653A (en) 1980-05-23
JPS6125217B2 true JPS6125217B2 (en]) 1986-06-14

Family

ID=15330718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14309278A Granted JPS5568653A (en) 1978-11-20 1978-11-20 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5568653A (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6378817A (ja) * 1986-09-20 1988-04-08 Ota Sheet:Kk 幌支持用フレ−ム
JPH02103862U (en]) * 1989-02-03 1990-08-17

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5119478A (en) * 1974-08-09 1976-02-16 Fujitsu Ltd Handotaisochino seizohoho
US4062720A (en) * 1976-08-23 1977-12-13 International Business Machines Corporation Process for forming a ledge-free aluminum-copper-silicon conductor structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6378817A (ja) * 1986-09-20 1988-04-08 Ota Sheet:Kk 幌支持用フレ−ム
JPH02103862U (en]) * 1989-02-03 1990-08-17

Also Published As

Publication number Publication date
JPS5568653A (en) 1980-05-23

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